【#Tech24H】On August 24, Xiaomi unveiled three XRING chips at once: the XRING O3, the XRING O100, and the XRING D100, China’s first 3nm autonomousdrivinggrade highcompute chip. Among them, the Xiaomi 18 Fold, which will be the first to feature the O3, is set to make its debut in September. The two AI compute chips, O100 and D100, will not reach devices until next year. The key highlights of this XRING “family bucket” include 3nm performance rivaling 2nm competitors, unique waferlevel packaging, domestic LPDDR6 memory, and joint development of chipmodel architectures. According to public information, the XRING team took more than four years from its inception to the release of the O1, but it took only one year to go from the O1 to the O3 and the two other AI chips: an efficiency far exceeding expectations. [ By Zhang Liyan | Tang Ruohan ]