Utilizing advanced thin-film lithium niobate materials, Chinese researchers have developed the world's first adaptive, full-band, high-speed wireless communication chip based on optoelectronic fusion integration technology. It possesses capabilities such as broadband wireless and optical signal conversion, low-noise carrier oscillator signal coordination, and digital baseband modulation, successfully bridging the "frequency gap" between devices operating in different bands. Its transmission rate exceeds 120 Gigabits per second, meeting 6G communication peak rate requirements, while maintaining consistent performance across the entire frequency band in end-to-end wireless communication links. This clears obstacles for the efficient exploitation of spectral resources in the terahertz and even higher frequency bands for 6G communications.