【Tech 24H】Researchers at Fudan University have developed the world's first two-dimensional-silicon hybrid architecture flash memory chip, addressing technical challenges in storage speed. This breakthrough deeply integrates ultrafast 2D flash memory with mature CMOS technology, overcoming key hurdles in the engineering of 2D information devices. The chip is expected to transcend the traditional trade-offs among speed, power consumption, and integration density in flash memory, potentially unlocking significant market opportunities in future 3D applications.