【#Tech24H】At its 2026 Investor Day, Qualcomm announced the launch of a new data center solution portfolio, encompassing the Qualcomm Dragonfly C1000 CPU, Qualcomm High-Bandwidth Computing (HBC) technology, Qualcomm Dragonfly AI300 inference accelerator, connectivity products, and custom chip solutions. All products are designed to maximize performance per watt and token throughput while reducing total cost of ownership for customers. The new platforms further strengthen Qualcomm Technologies' position in building AI-optimized full-stack data center infrastructure, covering agentic and data-center-grade CPUs, AI inference accelerators, high-bandwidth optical interconnects, and scalable high-performance custom chip solutions. Following the earlier introduction of Qualcomm Dragonfly AI200 and AI250, the Qualcomm Dragonfly AI300 will be officially incorporated into this data center solution portfolio, with the AI accelerator technology roadmap operating on an annual iteration cycle.