【#Tech24H】Although previous flexible central processing units (CPUs) could perform general-purpose computing, they faced bottlenecks such as low speed and high power consumption, failing to meet the demands of AI tasks like data classification and machine learning. The research achievement “FLEXI Flexible Digital In-Memory Computing Chip” from Tsinghua University represents a breakthrough in the fields of flexible electronics and edge artificial intelligence hardware, filling the current technological gap for high-performance flexible AI computing chips. Through co-optimization of design architecture and manufacturing processes, the chip achieves stable execution of neural network tasks under low-cost and low-power conditions. It can be adapted for extreme edge device application scenarios such as wearable health monitoring, providing a new direction for smart hardware innovation in the Internet of Things (IoT) domain.