【#Tech24H】Leapmotor and Qualcomm jointly announced a cross-domain fusion solution equipped with the Snapdragon Cockpit Platform Premium and the Snapdragon Ride Platform Premium (Snapdragon 8797). This dual-chipset architecture delivers excellent computing performance, which can both simplify the automotive electronic system structure, reduce overall complexity, and endow the vehicle with more advanced AI capabilities. This collaboration highlights the value of deep integration between chip manufacturers and automakers at the whole-vehicle architecture level, also providing a scalable blueprint for the industry's accelerated transition towards central computing architecture and fully software-defined vehicles.